Study of Wire Sweep and Wire Relaxation for 3-Dimensional and Multi-Chip Module Package
碩士 === 正修科技大學 === 機電工程研究所 === 98 === Nowadays, semiconductor industry has developed rapidly, therefore, in order to meet the portable, more powerful products has been introduced, for example, multi-chip module (MCM) and 3-Dimensional Package. This is often used in recent years, such as the new IC pa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29101538093527501336 |