Process Behavior Design of COF/OLB Package using a Sequential Metamodeling-Based Optimization Approach
碩士 === 逢甲大學 === 航太與系統工程所 === 98 === The continuous demand of electronic devices with great functional diversification, lightweight, portability and high performance has consistently pushed the development of integrated circuits (IC) packaging technologies toward miniaturization, flexibility, high de...
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| Format: | Others |
| Language: | zh-TW |
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2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06557835411357357838 |