The optimum process Analysis of wire sweep of IC Packaging
碩士 === 逢甲大學 === 機械工程學所 === 98 === The gold wire sweep has been the significant abnormal phenomenon in the IC package process. Especially in plastic fill process, if the manufacture process parameter disposes improper will cause short circuit occurrences and possibly expiration mechanism. Therefore t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/38830833675280730593 |