Bondability Analysis and Reliability Design on Copper Wire Bonding
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 98 === The wire bonding process has been widely used in the semiconductor package industry for the past two decades for its easy application and low cost. However, the mechanism of dynamic response for wire bonding process is scarcely reported due to the material da...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/28877948787564001882 |