An Application of Six Sigma on Die Saw Quality Improvement
碩士 === 國立高雄應用科技大學 === 工業工程與管理系 === 98 === ABSTRACT The development of IC assembly in recent years has focus on fast, multifunctional, high reliability and minimizing the IC, and having a higher density component and high pin count in the same time, Chip On Glass(COG) was introduced and soon to be t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35531347938899189634 |