Analysis of forming for cutting and bending leadframe of IC package and die design
碩士 === 國立高雄應用科技大學 === 模具工程系 === 98 === A study, the IC leadframe was punched and bended by a continuous stamping die. The specifications of the IC product is Sop 16L 300mil. The leadframe material is selected from C194, and the thickness is about 0.25mm. In addition, the molding material is selected...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38410772284370579241 |