| Summary: | 碩士 === 國立高雄應用科技大學 === 模具工程系 === 98 === A study, the IC leadframe was punched and bended by a continuous stamping die. The specifications of the IC product is Sop 16L 300mil. The leadframe material is selected from C194, and the thickness is about 0.25mm. In addition, the molding material is selected from Hitachi Chemical 9200. This product's original design with no pre-bending shape of the mold, and punching, bending and forming prone to nail from the frame and colloidal phenomena, lead to a bad production of finished products. In this study, we design a better process of the pre- forming and proceed to simulate the metal forming by using PRO-E and the DEFORM finite element analysis software. Firstly, the cut foot pre-forming mold and Single impulse and Double impulse shapes can be observed clearly and the accuracy of the analysis is increased is drawn by PRO-E. The head pre-forming punch foot angle and R angle are set as the design parameter. The head pre-forming punch foot angle and R angle are set as the design parameter. Through the analysis of results, best single rushed 30 °, dual-flush 35 ° pre-forming of bending pin interface maximum equivalent stress than the original single and double blanking is reduced by 97 Mpa, 60 Mpa, approximately 22.66 %, 16.48 %, Max equivalent of 0.064 mm/mm, 0.00962 mm/mm, about 20.8 % and 53.4 % of the maximum ratings, even briefly lead over the ZX direction shear stress reduced 18.3 Mpa, 4.7 Mpa, reduction of approximately 25.1 %, 11.13 %. The best single impulse -30 °, dual- impulse 35 ° preform process the total load is the original double-forming process reduces the overall load of 67 N, 256 N, about 6.4 %, 21.7 %. By way of preformed, effectively reducing forming load and reduce pin interface maximum equivalent stress, strain, leadframe and EMC ZX direction shear stress between the forming process in reducing adverse phenomena of finished products, improved product design.
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