Analysis of forming for cutting and bending leadframe of IC package and die design
碩士 === 國立高雄應用科技大學 === 模具工程系 === 98 === A study, the IC leadframe was punched and bended by a continuous stamping die. The specifications of the IC product is Sop 16L 300mil. The leadframe material is selected from C194, and the thickness is about 0.25mm. In addition, the molding material is selected...
Main Authors: | Su-Guang Lin, 林蘇廣 |
---|---|
Other Authors: | Chao-Ho Hsu |
Format: | Others |
Language: | zh-TW |
Published: |
2010
|
Online Access: | http://ndltd.ncl.edu.tw/handle/38410772284370579241 |
Similar Items
-
IC Leadframe Computer-Aided Design System
by: Shyh-Feng Shaw, et al.
Published: (1999) -
Punch Wear Analysis and Improvementfor IC Leadframe Dam-bar Cutting Process
by: Shihi-i Hsu, et al.
Published: (2009) -
Applications of Computational Fluid Dynamics and Mold Flow Analysis in the Leadframe Design and Quad Flat No-lead IC Package
by: CHANG, HUNG-PIN, et al.
Published: (2017) -
Automatic Vision Inspection for IC Leadframe Surface Defects
by: Da-Chin, Lee, et al.
Published: (1999) -
A Leadframe Minimization Method for System-In-Package
by: Shin-Chuan Lai, et al.
Published: (2005)