Effects of Polyvinyl alcohol on the Adhesion of Electroless Copper Deposition layer
碩士 === 明新科技大學 === 化學工程研究所 === 98 === The key step of damascene process lies in the fill in technology of metals. Among the available copper fill in methods, electroless copper deposition is an important technology that becomes the focus of IC copper interconnects in recent years. This research focu...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97323365420886913316 |