The effects of additive on the different thickness polyimide for electroless copper plating
碩士 === 明新科技大學 === 化學工程研究所 === 98 === In this research, conductive polyimide films with different thickness(25μm,50μm and 75μm) were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The pH values of plating solution and additives( polyvinyl alcoho and p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73083480862971828128 |