| Summary: | 碩士 === 明新科技大學 === 化學工程研究所 === 98 === In this research, conductive polyimide films with different thickness(25μm,50μm and 75μm) were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The pH values of plating solution and additives( polyvinyl alcoho and potassium iodide ) on the effects of plating rate,surface morphology,crystalline and resistivity of copper deposition for the electroless copper plating. The surface of these films was treated with additives which exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray, to analysis crystallization change, by using EPMA to analysis surface texture,by using four-point probe to analysis electric properties. These results show that the surface morphology of copper deposition was smooth and dense with addition of the polyvinyl alcohol(PVA) and potassium iodide.
The other purpose of this research is the test of the electromagnetic interference (EMI), the test results shows the shielding effectiveness(SE) of interference of films can be above 50dB. That two kinds of additives PVA and KI were added to the plating bath together,increasing EMI shielding effect from 50dB to the best SE of 80dB. At this level, 99.999999％ extraneous radiation is either reflected or absorbed by these treated films,and have the excellent shielding effectiveness of electromagnetic interference.
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