Effects of Sodium Thiosulfate on Adhesion of Copper Deposition Layer on FR-4 Laminate
碩士 === 明新科技大學 === 化學工程研究所 === 98 === This thesis discuss about the effects of adhesive in electroless and sputtering copper plating deposition on FR-4. After electroless copper deposition and electro copper plating, conduct the measures of the surface adhesive force by using pull-off test, and com...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13137498280664030935 |