Analysis of PCB Bonder Machine
碩士 === 明新科技大學 === 精密機電產業研發碩士外國學生專班 === 98 === The main objective of this study is to analyze the rigidity of bonder machine in Printed Circuit Board (PCB) process. PCB process is one of steps in Thin Film Transistor Liquid Crystal Display (TFT-LCD) manufactory process that includes 7 steps....
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56343539439454779109 |