Development of New Formula for Filling Through-Hole by Copper Electroplating
碩士 === 國立中興大學 === 化學工程學系所 === 98 === The size of electronic products is requested to be smaller and smaller. They provide several advantages such as reduced packaging area, light weight, higher interconnection density, high reliability, and excellent electrical performance with lower resistance....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03989723978302179665 |