A Novel Cu Plating Formula for Filling Through Silicon Vias
碩士 === 國立中興大學 === 化學工程學系所 === 98 === The development of science and technology continuously progresses. Electronic components increasingly become small, thin, short and light. The evolution of semiconductor technology has reached a point where the packaging now plays an important role in the overall...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99717834931596443594 |