A Novel Cu Plating Formula for Filling Through Silicon Vias

碩士 === 國立中興大學 === 化學工程學系所 === 98 === The development of science and technology continuously progresses. Electronic components increasingly become small, thin, short and light. The evolution of semiconductor technology has reached a point where the packaging now plays an important role in the overall...

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Bibliographic Details
Main Authors: Shao-Ping Shen, 沈紹平
Other Authors: Wei-Ping Dow
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/99717834931596443594

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