The Application of Failure Modes and Effects Analysis to Improve Design and Process Development Stage of Electroformed Thin Mold ─ A Case Study of A Taiwan Nameplate Corporation
碩士 === 國立中興大學 === 企業管理學系所 === 98 === Rapid changes in the industrial environment and fierce competition by globalization, Electronic product life cycle getting is shortened gradually, The New Products Availability accords with Market demand, all trades to develop the new products for target. How ab...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79302247065674823567 |