Optimal Design of Fatigue Life for Direct Chip Attach Package by Using Response Surface Method and Genetic Algorithm
碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === In recent years, with the character of frivolity, short size and high speed, the application of the Direct Chip Attach technique on the packages has gradually increased. Among those techniques, the flip chip type became the mainstream in the product market. As...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76786111245330909910 |