Analysis of IC Socket Spring Pin Contact Resistance
碩士 === 國立成功大學 === 工程科學系專班 === 98 === The manufacturing of an IC electronic device goes through various processes from wafer fabrication to assembly, experiencing different levels of tresses and risks. The final test validates the functionality of each DUT (Device Under Test) in the package form befo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96341549913303846524 |