Wire bonding optimization through design of experiment of the circuit-under-pad devices
碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === With the trend of consumer electronics pushing toward thin﹐light﹐small﹐mobile and high performance﹐the manufacturing of semiconductors from IC design﹐wafer fabrication and device assembly is important. In the advanced wafer process﹐the space under the bonding...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47000912184895336580 |