The Study on Oxidation Microstructure and Bonding Electrification Characteristic of Fine Copper Wire
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === Besides cost advantage, copper possesses higher electrical and thermal conductivity than gold. In wire bonding process, there is a trend using copper wire to replace gold wire. The aim of this study is to investigate the oxidized microstructure and bonding...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26104594431824957067 |