Effect of Annealing Temperature on Recrystallization and Tensile Properties of Wire Bonding 23μm Silver Wires
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === Silver is a novel wire material of wire bonding process because its excellent electrical and thermal properties, it’s more expensive than copper but cheaper than gold, and it’s lower hardness and hard to oxidative compared to copper. In this study, the ef...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20558853373144805511 |