Investigation of Nano-scale Copper ECMP Mechanism on Damascene Process for Semiconductor Integrated Circuits
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === This dissertation explores nano-scale copper (Cu) electrochemical mechanical planarization (ECMP) mechanism on damascene process for semiconductor integrated circuits. ECMP process has no abrasive particle because the broken circuits are formed by scratche...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/85430876509393968419 |