Study on Phase Transformation of Metallic Nanoparticles for Next Generation Microelectronic Interconnections
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === By utilizing the drastically reduced melting temperature of nano-sized particles (NPs), one of recent developments in microelectronic packaging is to manufacture highly conductive interconnections with metallic nanoparticle deposits subjected to a low te...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01190241649820948780 |