Warpage Modeling of Electronic Package During the Post-Mold Curing Process
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === Warpage is one of the most critical issues in electronic industry, it has strong implication on the board reflow assembly yields for area-array packages, excessive warpage may lead to difficulties of electrical interconnection. Package warpage typically occurs...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04042633982347789635 |