Investigation of Joule heating effect and thermomigration in flip-chip solder joints under current stressing
博士 === 國立交通大學 === 材料科學與工程系所 === 98 === To meet the miniaturization trend of portable devices, the dimensions of the solder bumps continue to shrink, causing the current density in each solder joint to increase abruptly. With the increase of applied current, the temperature increased rapidly due to J...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66903976417169423531 |