Power Integrity in TSV 3D Integration
碩士 === 國立交通大學 === 電子研究所 === 98 === Three-dimensional (3D) nanosystems can provide enormous advantages in achieving multi-functional integration, improving system speed and reducing power consumption for future generations of ICs. The robust power delivery system is very important in 3D ICs. In 3D in...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18630365856775057214 |