Design and Implementation of Flip-Chip Self-Aligned Mechanism
碩士 === 國立交通大學 === 機械工程系所 === 98 === In bonding process of flip chip, when there is an angle between the chip and the substrate, bonding can only be achieved at one corner or broken bumps to affect package quality of flip chip. The main purpose of this thesis is design a self-alignment system for fli...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01582995047820751932 |