The Abrasion Mechanism of Pad Conditioning and Its Effect on Chemical Mechanical Polishing
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 98 === In advanced semiconductor processes, with continuously decrement in line dimension and increment in layers adopted for multi-layer interconnect structure, the challenge with surface flatness and topography becomes more and more serious. For photolith...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19617804547272895216 |