Electromigration Study in Flip-Chip SnPb Solder Joints with 5-um Cu Under-bump-metallization
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 98 === Flip-chip technology has become a mainstream trend in advanced electronic packaging because of its capability of higher I/O density and smaller package size. With higher current and smaller size trends, electromigration in flip-chip solder has become...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40024027573537688129 |