Three-Dimensional Architecture Exploration and Testing of Content Addressable Memories
碩士 === 國立中央大學 === 電機工程研究所 === 98 === Three-dimensional (3-D) integrated chip (IC) design technology is now widely acknowledged as one of the future chip design technologies. A 3-D IC has many benefits over a conventional 2-D IC, such as small form factor, high functionality, high performance, and lo...
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36278653279232408150 |