Testing and Repair of Memories in 3D-SiP Chips
碩士 === 國立中央大學 === 電機工程研究所 === 98 === System-in-Package (SiP) integration technology provides a good solution for integrating components with different technologies. In an SiP, typically, various types of dies are stacked and connected with bonding wires. Among those dies, memory die is one widely us...
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79093544799451011670 |