Architecture Exploration and Evaluation Methods for Memories in 3D ICs
碩士 === 國立中央大學 === 電機工程研究所 === 98 === Three-dimensional (3D) integration technology using through-silicon-via (TSV) has been widely acknowledged as one of future integrated circuit (IC) design technologies. 3D integration technology offers many benefits over 2D integration technology, such as high pe...
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29088975323145495325 |