The Effects of Design Parameters on BGA Packages to Acceleration Models and Acceleration Factors
碩士 === 國立彰化師範大學 === 機電工程學系 === 98 === The reliability of BGA (Ball Grid Array) products is one of the critical factors, which influence the lifetime of electronic products, and there are many literatures probing into the failure causes by temperature fatigue. To foresee the lifetime of BGA, various...
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| Format: | Others |
| Language: | zh-TW |
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2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41354835857776847908 |