Study on interfacial morphology of microelectronic solder joints with electroless Ni-Zn-P under bump metallization
碩士 === 國立東華大學 === 材料科學與工程學系 === 98 === In order to improve the performance of electroless Ni-P as under bump metallizations (UBM), this study developed ternary Ni-Zn-P electroless deposited films and investigated the compositional effect on their crystallization behavior and interfacial reactions wi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15156848023369648859 |