Built-In Self-Test and Built-In Self-Repair Design for TSV-based 3D IC
碩士 === 國立東華大學 === 電機工程學系 === 98 === This thesis draws up a built-in self-test (BIST) and built-in self-repair (BISR) design which apply to through silicon via (TSV)-based three-dimension integrated circuits (3D ICs). The design of BIST in this thesis is focus on the testing in TSV-based 3D ICs, and...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53300262198140999137 |