Solder Ball Stress Prediction Analysis for Package with Compound Loadings of Random Vibration and Thermal Effect
碩士 === 國立屏東科技大學 === 機械工程系所 === 98 === A reliable and accurate analytical model is desired for the printed circuit board (PCB) with IC package to predict the system response due to loadings such as shock and vibration simulation or even with thermal effect. This work addresses the procedure of model...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/35030906427902799307 |