Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications
碩士 === 國立中山大學 === 電機工程學系研究所 === 98 === In this thesis, we propose a simple trench oxide layer polysilicon thin-film Transistor (TO TFT) process and the self-heating effects can be significantly reduced because of its structural advantages. According to the ISE-TCAD simulation results, our proposed T...
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ndltd-TW-098NSYS54420572015-10-13T18:39:46Z http://ndltd.ncl.edu.tw/handle/62184136431112541817 Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications ㄧ個新溝槽式氧化層TFT特性探討與在1T-DRAM上的應用 Hsien-Nan Chiu 邱憲楠 碩士 國立中山大學 電機工程學系研究所 98 In this thesis, we propose a simple trench oxide layer polysilicon thin-film Transistor (TO TFT) process and the self-heating effects can be significantly reduced because of its structural advantages. According to the ISE-TCAD simulation results, our proposed TO TFT structure has novel features as follows: 1. The buried oxide and the isolation oxide are carried out simultaneously in order to achieve a goal of simple process. 2. The trench design is used to improve both the sensing current windows (~ 84%) and the retention time (~ 57%). 3. The thermal stability is drastically improved by its naturally formed source/drain tie. The above mentioned features help our proposed device structure to demonstrate the desired characteristics that are better than that of a conventional TFT. Additionally, the thermal instability is drastically improved which is good for long-term device operation. Jyi-Tsong Lin 林吉聰 2010 學位論文 ; thesis 56 zh-TW |
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碩士 === 國立中山大學 === 電機工程學系研究所 === 98 === In this thesis, we propose a simple trench oxide layer polysilicon thin-film Transistor (TO TFT) process and the self-heating effects can be significantly reduced because of its structural advantages. According to the ISE-TCAD simulation results, our proposed TO TFT structure has novel features as follows: 1. The buried oxide and the isolation oxide are carried out simultaneously in order to achieve a goal of simple process. 2. The trench design is used to improve both the sensing current windows (~ 84%) and the retention time (~ 57%). 3. The thermal stability is drastically improved by its naturally formed source/drain tie. The above mentioned features help our proposed device structure to demonstrate the desired characteristics that are better than that of a conventional TFT. Additionally, the thermal instability is drastically improved which is good for long-term device operation.
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author2 |
Jyi-Tsong Lin |
author_facet |
Jyi-Tsong Lin Hsien-Nan Chiu 邱憲楠 |
author |
Hsien-Nan Chiu 邱憲楠 |
spellingShingle |
Hsien-Nan Chiu 邱憲楠 Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
author_sort |
Hsien-Nan Chiu |
title |
Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
title_short |
Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
title_full |
Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
title_fullStr |
Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
title_full_unstemmed |
Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM Applications |
title_sort |
characteristics of a new trench oxide layer polysilicon thin-film transistor and its 1t-dram applications |
publishDate |
2010 |
url |
http://ndltd.ncl.edu.tw/handle/62184136431112541817 |
work_keys_str_mv |
AT hsiennanchiu characteristicsofanewtrenchoxidelayerpolysiliconthinfilmtransistorandits1tdramapplications AT qiūxiànnán characteristicsofanewtrenchoxidelayerpolysiliconthinfilmtransistorandits1tdramapplications AT hsiennanchiu yi1gèxīngōucáoshìyǎnghuàcéngtfttèxìngtàntǎoyǔzài1tdramshàngdeyīngyòng AT qiūxiànnán yi1gèxīngōucáoshìyǎnghuàcéngtfttèxìngtàntǎoyǔzài1tdramshàngdeyīngyòng |
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