Reliability Analysis of 3D Heterogeneous Integrated Microsystem Chip
碩士 === 國立清華大學 === 動力機械工程學系 === 98 === The reliability analysis of whole structure is an important part in the researching and developing process of 3D heterogeneous integration microsystem chip. And building the reliability of finite element analysis (FEA) simulation for figuring out the relationsh...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18606420567844841975 |