Performance Characterization of TSV in 3D IC via Sensitivity Analysis
碩士 === 國立清華大學 === 電機工程學系 === 98 === In this thesis, we propose a method that can characterize the propagation delays across the Through Silicon Vias (TSVs) in a 3D IC. We adopt the concept of the oscillation ring test, in which two TSVs are connected with some peripheral circuits to form an oscillat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16329515050348150444 |