The reliability analysis of thermal conductivity measurement at Thermal Pad and Thermal insulated materials
碩士 === 國立清華大學 === 工程與系統科學系 === 98 === Abstract In order to reduce the thermal resistance contact from thermal modules and heat source, we need to use thermal interface material (Thermal Interface Material, TIM) to effectively remove the heat which is generated by the CPU and achieve the purpose of c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80745736821406298480 |