Study of Electromigration in Flip Chip Solder Joints under Extra High Current Density with Temperature Control
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 98 === To meet the requirement for decreasing packaging size, the electron current density through flip chip solder joints has to increase with every new generation of devices. At this condition, electromigration in flip chip solder joints become a serious issue. In...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85968357685244654339 |