Longitudinal Patent Analysis for Chemical Mechanical Polishing Pad
碩士 === 國立臺灣大學 === 圖書資訊學研究所 === 98 === As the feature sizes of Integrated Circuits continue to shrink, the ability to globally planarize the wafer surface becomes increasingly important. The Chemical Mechanical Polishing or Planarization (CMP) is regarded as the most successful planarization process...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49984018482904859883 |