Engineering property of cement concrete with additive of CMP sludge
碩士 === 國立聯合大學 === 土木與防災工程學系碩士班 === 98 === Chemical mechanical polishing (CMP) is a conventionally adopted process in integrated-circuit (IC) factories during the process called “planarization”on silicon wafers. Because planarization consumes considerable amounts of super pure water, and leads to lar...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29091068964782821214 |