Integration of DFMEA and regression method in warpage forecast interface design of semiconductor IC product
碩士 === 樹德科技大學 === 應用設計研究所 === 98 === To fulfill the goals of high performance and density, semiconductor IC products are required to be as small and light as possible, which will diminish the firmness of the IC structure. Consequently, the possibility of warpage is increasing dramatically. This stud...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42884838726925133522 |