Electromigration effect on the interfacial reaction of Sn-Ag lead-free solder and Electroless Ni plate
碩士 === 南台科技大學 === 奈米科技研究所 === 98 === This study has investigated the effect of electromigration on Sn-3.5Ag solder and electroless nickel plate interface layer. This study investigates the effects of electromigration on the microstructure and interface reaction of solder joints . First of all, TiO2...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82969795853283874775 |