Application of Compliance Mechanism in the Grinding and Polishing of Semispherical Surfaces
碩士 === 國立臺北科技大學 === 製造科技研究所 === 98 === The purpose of this paper is to investigate the effects of different spring rate on the machine surface roughness and contour roundness by using an compliance mechanism attached to the grinding or polishing tools. In this study, the material used is NAK80 die t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hsb2t3 |