Analysis of the Effects of Via Placements upon the Signal Reflection and EMI Radiation for Multilayer Printed Circuit Boards
碩士 === 淡江大學 === 電機工程學系碩士在職專班 === 98 === There are considerable transmission lines in a multi-layer printed circuit boards , while usually some transmission lines can not be connnected to the receiving end directly. Conversely, vias have to be employed to connect the transmission lines located in dif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61106345768426273501 |