Environmental Impact Assessment of Packaging Process of Thin small outline package(TSOP)
碩士 === 環球技術學院 === 環境資源管理所 === 98 === Abstract The manufacturing of IC products must rely on a lot of metallic materials and chemical substances. Its impact on the environment is obvious. Manufacturers need to take into account of the environmental impacts during the life cycle of the products,...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37927562449432236917 |