Environmental Impact Assessment of Packaging Process of Thin small outline package(TSOP)

• Main Authors: Chia-Hau Pan, 潘家豪
• Other Authors: Shi-Chin Wu
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/37927562449432236917

碩士 === 環球技術學院 === 環境資源管理所 === 98 === Abstract The manufacturing of IC products must rely on a lot of metallic materials and chemical substances. Its impact on the environment is obvious. Manufacturers need to take into account of the environmental impacts during the life cycle of the products, under the international regulations, “Restriction of Hazardous Substances ” (RoHS) and the " Energy Using Product Directive " (EuP). In this study, life cycle assessment software "SimaPro 6.0" was used to evaluate the impacts of four thin small outline package (TSOP) technologies on the environment. The eco-indicator95 and eco-indicator99 methods were used together with SimaPro to express the total environmental load in a single score, and to provide the basis for the calculation of eco-indicator scores for materials and processes, respectively. The calculated environmental impacts from the eco-indicator95 showed that acidification and heavy metal are the most significant impact factors; those from the eco-indicator99 showed that the resources matter most. Furthermore, the results from the evaluation of manufacturing process showed that molding compound, plating and lead frame were the three most significant sources of impacts. The results from the evaluation of energy and resources showed that amount of electricity, epoxy and metallic materials used are the key sources of impacts, which are also the key to the process improvement. The future work could focus on the manufacturing stage, together with designing and testing stages to complete the life cycle assessment of the industry. Keywords: life cycle assessment, IC package, TSOP, Eco-Indicator